The characteristics of thermally conductive gap filler

Model: GD-150GF、GD-350GF

Thermally Conductive Gap Filler: It is a soft and compressible interface material with high thermal conductivity. Its core function is to fill the physically air gap between heat-generating electronic components (such as CPUs, power chips) and heat sinks (such as heat sinks).

Typical Applications：power supply, telecommunications, industrial electronics, and automotive electronics, etc.

Functions: Fill gaps, thermally conduct, and relieve thermal expansion coefficient (CTE) mismatch stress.